ficonTEC proudly announces the release of a new single-sided electro-optical wafer-level tester, a first-of-its-kind solution fully compatible with the world’s two largest semiconductor ATE (automated ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVM9284 CameraCubeChip™ module—the world’s first ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVMed® OCHTA camera module with quadruple the ...
Plus other notable product, system and installation news from this week’s optical communications expo in San Diego. Nanoimprint of wafer-level optics on silicon photonics wafer (Left) for Teramount ...
Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) Kicking off this ...
Tower Semiconductor Ltd. (NASDAQ:TSEM) shares are trading higher on Wednesday after the firm unveiled a new foundry path for co-packaged optics. The company expanded its wafer-scale 3D-IC platform to ...
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