Leuven, Belgium. Imec and Cascade Microtech, a FormFactor company, have announced the successful development of a fully automatic system for pre-bond testing of advanced 3D chips. Pre-bond testing is ...
Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with sufficient yield. “With chiplets, ...
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