Debug and physical failure analysis (PFA) of heterogeneously integrated semiconductor packages, particularly die-to-die (D2D) input/output (I/O) type fails, has become very challenging due to the lack ...

A crucial stage in the research and development (R&D) process is understanding how and why materials degrade and ultimately falter. Polymers often fail in short timescales compared to the lifespan of ...

The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

A Rocket Lab electron lifts off May 15 from the company’s New Zealand launch site. The launch failed minutes later when the second stage’s engine appeared to shut down seconds after ignition. Credit: ...

When a chip malfunctions it’s the job of the failure analysis engineer to determine how it failed or significantly deviated from its key performance metrics. The cost of failure in the field can be ...

Defect correlation analysis is a new approach in IC failure analysis technology. Proper failure analysis can provide useful and cost-saving data for companies in control of their design and ...

Applications in NVIDIA’s failure analysis laboratory. Cambridge, UK – TeraView, the pioneer and leader in terahertz technology and solutions, is pleased to announce that NVIDIA has presented two ...

Intel Tech Tour offers those who attend access to the company's labs and product development corners, offering tech outlets and others a chance to get a peek behind the curtain of one of the biggest ...

A complete oil analysis requires only 12 ml of oil and no chemicals or solvents for sample preparation or cleaning. The whole analysis, including all four tests, takes around 5 - 7 minutes, depending ...