EDN

A new platform for thermally stable DRAM peripheral transistors

Dynamic random-access memory (DRAM) chips contain many other transistors besides the access transistor to enable full operation of the DRAM memory. These peripheral transistors must meet stringent ...
Semiconductor Engineering

Insights Into Advanced DRAM Capacitor Patterning: Process Window Evaluation Using Virtual Fabrication

With continuous device scaling, process windows have become narrower and narrower due to smaller feature sizes and greater process step variability [1]. A key task during the R&D stage of ...
EDN

DRAM MIMCAP process is next focus for IMEC 32-nm project

LONDON — Belgian research organization IMEC has extended its work on 32-nm CMOS device scaling to include a project on DRAM MIMCAP (metal-insulator-metal capacitors) process technology. The group says ...
TweakTown

Samsung's 1c DRAM yields leap: 0% to 40% giving the greenlight for HBM4 mass production

TL;DR: Samsung's 1c DRAM yield for next-gen HBM4 memory has improved from 0% to around 40%, enabling planned mass production later this year. Design restructuring and process optimizations enhanced ...