The founding team of CEO Sophia Millar, Chief Technical Officer George Hallo, and Chief Product Officer Hooman Piroux ...

As semiconductor chip technology advances towards nanometre and sub-nanometre scales, the demands becomes exponentially more ...

For a long time, semiconductor defect inspection focused on particles, and particle defects remain an important cause of yield loss. But as devices have become more complex, additional kinds of ...

MILPITAS, Calif., July 8, 2019 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the 392x and 295x optical defect inspection systems and the eDR7380™ e-beam defect review system. The new ...

MILPITAS, Calif.--(BUSINESS WIRE)--Today KLA-Tencor Corporation (NASDAQ:KLAC), the world’s leading supplier of process control and yield management solutions for the semiconductor and related ...

The Atomic Force Microscope (AFM) has evolved from an extremely high resolution scientific research instrument into a highly accurate metrology tool. This evolution has broadened the role of the AFM ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

The current defect inspection systems for packaging are running out of steam for the latest advanced packages, prompting the need for new tools in the market. All of this comes at a time when the ...

insights from industryDr. Thomas FriesFounder and CEOFRT GmbH In this article, AZoM, talks to Dr. Thomas Fries, Founder and CEO of FRT GmbH, about the applications of both defect inspection and ...

Business competition pressures manufacturers to produce faster, reduce expenses, and increase efficiencies. But all these requirements run into the quality control issue sooner or later — with the ...